Method for inspecting filled state of via-holes filled with fill

Optics: measuring and testing – By configuration comparison – With comparison to master – desired shape – or reference voltage

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

356237, 382 8, G01B 1100, G01N 2100, G06K 900

Patent

active

050150979

ABSTRACT:
A method for inspecting the filled state of a plurality of via-holes which pass through a non-conductive circuit board and are filled with a conductive substance and an apparatus for carrying out the method are disclosed.
The surface of the circuit board is illuminated in two directions to generate shadows depending on the concave or convex state of the fillers in a plurality of via-holes. An optical image of the illuminated surface of the circuit board is detected. Each edge of the two shadow areas, which exist in the detected optical image and are generated in one via-hole by light irradiation in two directions, is detected. Whether the filler in this one via-hole is in the concave state or convex state is identified according to the mutual position relationship of the detected edges. The length of each shadow area is detected, and whether the concave state or convex state of the filler is within a predetermined allowance is decided according to the detection results. The area of the image of the filler is detected according to differences between the brightness of the board surface or of the via-hole wall and the brightness of the filler in the via-hole in the detected optical image, and whether the filler is lacking or not is decided according to the detection result.

REFERENCES:
W. E. Blanz, J. L. C. Stanz, E. B. Hinkle, "Image Analysis Methods for Solder Ball Inspection in Integrated Circuit Manufacturing", Proc. IEEE Int. Conf. on Robotics & Automation, pp. 509-514, 1987.
John R. Kender, Earl M. Smith, "Shape from Darkness: Deriving Surface Information from Dynamic Shadows", Proc. of 1st Int. Conf. Compt. Vision, pp. 539-546, 1987.
Singo Sekiguchi, Mitsutaka Ito, Shinichi Uno, "Apparatus for Inspecting Devices Mounted on Circuit Board (Chip Checker)", Papers of 2nd Symposium of Image-Sensing Technics in Industry, pp. 291-294, Jul. 1987.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for inspecting filled state of via-holes filled with fill does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for inspecting filled state of via-holes filled with fill, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for inspecting filled state of via-holes filled with fill will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1644149

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.