Process for treating aluminum surfaces in a vacuum apparatus

Details Process for treating aluminum surfaces in a vacuum apparatus Process for treating aluminum surfaces in a vacuum apparatus

Filed on

1991-05-23

Date issued

1993-04-13

Examiner

Powell, William A.

Patent Class

Adhesive bonding and miscellaneous chemical manufacture

SubClass

Delaminating processes adapted for specified product

SubSubClass

Delaminating in preparation for post processing recycling step

Other Related Categories

156656, 156665, 427576, B44C 122, C23F 100, B05D 306

Type

Patent

Status

active

Patent number

052019900

Description

ABSTRACT:
A process is described for inhibiting the vaporization or sublimation of aluminum base alloy surfaces when exposed to temperatures in excess of 400.degree. C. in a vacuum chamber used for the processing of semiconductor wafers. The process comprises treating such aluminum base alloy surfaces with a plasma comprising a nitrogen-containing gas selected from the group consisting of nitrogen and ammonia. When nitrogen gas is used, the plasma must also contain hydrogen gas. When the vacuum chamber being treated is intended to be used for the deposition of tungsten, the maximum flow of the nitrogen-containing gas into the chamber for the initial 10 seconds of the treatment process must be controlled to avoid impairment of the subsequent tungsten depositions in the chamber. After the treatment step, the cleaned and treated aluminum surface is preferably passivated with nitrogen (N.sub.2) gas.

REFERENCES:
patent: 4975147 (1990-12-01), Tahara et al.
patent: 4992136 (1991-02-01), Tachi et al.
patent: 5035751 (1991-07-01), Nagashima et al.

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