Interposer for semiconductor device

Details Interposer for semiconductor device Interposer for semiconductor device

1996-07-18

1999-02-02

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257780, 257796, H01L 2348

Patent

active

058669485

ABSTRACT:
A substrate 1 of a insulating resin material is provided with a semiconductor chip 2 in the center of the substrate 1 and a lot of fine studs are filled in the substrate 1 around the chip 2. A bonding pad 13 and a land 14 are formed on both end planes of each stud 12 by silver plating. The length of the stud 12 is determined so that the plane of the land 14 and the back side plane of the substrate are approximately co-planar, but it may be longer. The substrate 1 including the studs 12 having the bonding pad 12 and the land 14 is defined as an interposer 15.

REFERENCES:
patent: 5508556 (1996-04-01), Lin
patent: 5581444 (1996-12-01), Furino, Jr.
patent: 5640048 (1997-06-01), Selna

Affiliated with

Also associated with

Rating

Interposer for semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interposer for semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interposer for semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1120119