Wafer inspection system for distinguishing pits and particles

Optics: measuring and testing – Inspection of flaws or impurities – Surface condition

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356364, G01N 2100

Patent

active

061185256

ABSTRACT:
A surface inspection system and method is provided which detects defects such as particles or pits on the surface of a workpiece, such as a silicon wafer, and also distinguishes between pit defects and particle defects. The surface inspection system comprises an inspection station for receiving a workpiece and a scanner positioned and arranged to scan a surface of the workpiece at the inspection station. The scanner includes a light source arranged to project a beam of P-polarized light and a scanner positioned to scan the P-polarized light beam across the surface of the workpiece. The system further provides for detecting differences in the angular distribution of the light scattered from the workpiece and for distinguishing particle defects from pit defects based upon these differences.

REFERENCES:
patent: 3749496 (1973-07-01), Hietanen et al.
patent: 3904293 (1975-09-01), Gee
patent: 4297032 (1981-10-01), Temple
patent: 4314763 (1982-02-01), Steigmeier et al.
patent: 4441124 (1984-04-01), Heebner et al.
patent: 4448527 (1984-05-01), Milana
patent: 4469442 (1984-09-01), Reich
patent: 4505585 (1985-03-01), Yoshikawa et al.
patent: 4508450 (1985-04-01), Ohshima et al.
patent: 4541712 (1985-09-01), Whitney
patent: 4630276 (1986-12-01), Moran
patent: 4740708 (1988-04-01), Batchelder
patent: 4764017 (1988-08-01), Hirvonen
patent: 4794264 (1988-12-01), Quackenbos et al.
patent: 4794265 (1988-12-01), Quackenbos et al.
patent: 4875780 (1989-10-01), Moran et al.
patent: 4889998 (1989-12-01), Hayano et al.
patent: 4893932 (1990-01-01), Knollenberg
patent: 4898471 (1990-02-01), Stonestrom et al.
patent: 4902131 (1990-02-01), Yamazaki et al.
patent: 4922308 (1990-05-01), Noguchi et al.
patent: 4933567 (1990-06-01), Silva et al.
patent: 4966457 (1990-10-01), Hayano et al.
patent: 4991445 (1991-02-01), Le Bail et al.
patent: 4991964 (1991-02-01), Forgey et al.
patent: 5030842 (1991-07-01), Koshinaka et al.
patent: 5032734 (1991-07-01), Orazio et al.
patent: 5067798 (1991-11-01), Tomoyasu
patent: 5108176 (1992-04-01), Malin et al.
patent: 5125741 (1992-06-01), Okada et al.
patent: 5127726 (1992-07-01), Moran
patent: 5135303 (1992-08-01), Uto et al.
patent: 5177559 (1993-01-01), Batchelder et al.
patent: 5189481 (1993-02-01), Jann et al.
patent: 5191466 (1993-03-01), Gross et al.
patent: 5355212 (1994-10-01), Wells et al.
patent: 5369286 (1994-11-01), Cheng
patent: 5389794 (1995-02-01), Allen et al.
patent: 5424536 (1995-06-01), Moriya
patent: 5436464 (1995-07-01), Hayano et al.
patent: 5461474 (1995-10-01), Yoshii et al.
patent: 5465145 (1995-11-01), Nakashige et al.
patent: 5486919 (1996-01-01), Tsuji et al.
patent: 5585916 (1996-12-01), Miura et al.
patent: 5625193 (1997-04-01), Broude et al.
patent: 5717485 (1998-02-01), Ito et al.
patent: 5798829 (1998-08-01), Vaez-Iravani
patent: 5903342 (1999-05-01), Yatsugake et al.
patent: 5936726 (1999-08-01), Takeda et al.
Bawolek, "Light Scattering by Spherical Particles on Semiconductor Surfaces," 1992 Ph.D. Dissertation at Arizona State University, pp. i-281.
Starr et al., "Comparison of Experimentally Measured Differential Scattering Cross Sections of PSL Spheres on Flat Surfaces and Patterned Surfaces," SPIE vol. 2862, (Sep. 1996) pp. 130-138.
Wolfe et al., "A Portable Scatterometer for Optical Shop Use," SPIE vol. 525 (1985) pp. 160-165.
Magee et al., "Near-specular Performance of a Portable Scatterometer," SPIE vol. 675 (1986) pp. 249-259.
Bickel et al., "The Role of Polarization in the Measurement and Characterization of Scattering," SPIE vol. 679 (1986) pp. 91-98.
Iafelice et al., "Polarized Light-Scattering Matrix Elements for Select Perfect and Perturbed Optical Surfaces," Applied Optics 26 (12) (1987) pp. 2410-2415.
Bickel et al., "Stokes Vectors, Mueller Matrices and Polarized Scattered Light: Experimental Applications to Optical Surfaces and All Other Scatterers," SPIE vol. 1530 (1991) pp. 7-14.
Bickel et al., "Polarized Light Scattering from Metal Surfaces," J. of Applied Physics 61 (12) (1987) pp. 5392-5398.
Kylner et al., "Scattering Signatures of Isolated Surface Features," SPIE vol. 1995 (1993) pp. 66-72.
TMA Technologies, "TMA QuikScan.TM. Scatterometer," (1991) Brochure, 4 pages.
"Manufacturing: Scatterometers Improve Laser Mirrors," Potonics Spectra vol. 25, Issue 8 (Aug. 1991) p. 100.
Rifken et al., "Design Review of a Complete Angle Scatter Instrument," SPIE vol. 1036 (1988) pp. 116-124.
Stover et al., "Optical Scattering Measurement and Analysis," (1995) Second Edition.
Wagner et al., "Requirements of Future Measurement Equipment for Silicon Wafers," SPIE vol. 2862 (Sep. 1996) pp. 152-162.
Nebeker, "Modeling of Light Scattering from Structures with Particle Contaminants," SPIE vol. 2862 (Sep. 1996) pp. 139-150.
Stover et al., "Measurement and Analysis of Scatter from Silicon Wafers," SPIE vol. 2260 (1994) pp. 182-191.
Stover et al., "Some Deviations Associated with Vector Perturbation Diffraction Theory," SPIE vol. 511 (1984) pp. 12-17.
Sasse, "Angular Scattering Measurements and Calculations of Rough Sphericallly Shaped Carbon Particles" SPIE vol. 2541 (1995) pp. 131-139.
Nee, "Reflection, Scattering, and Polarization from a Very Rough Black Surface," SPIE vol. 1995 (1993) pp. 202-212.
Church et al., "Scattering by Anisotropic Grains in Beryllium Mirrors," SPIE vol. 1331 (1990) pp. 12-17.
Stover, Editor, "Optical Scattering: Applications, Measurement, and Theory II," vol. 1995 (1993), pp. 1-302.
Videen et al., "Polarized Light Scattered from Rough Surfaces," Opt. Soc. Am., vol. 9, No. 7 (1992), pp. 1111-1118.

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