4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates
  6. Thinning of semiconductor substrate

Yves-Matthieu Le Vaillant

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Method for transferring an epitaxial layer

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Reexamination Certificate

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Methods for fabricating a wafer structure having a strained...

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate

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Tools and methods for disuniting semiconductor wafers

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Reexamination Certificate

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