Tools and methods for disuniting semiconductor wafers

Details Tools and methods for disuniting semiconductor wafers Tools and methods for disuniting semiconductor wafers

2006-12-06

2010-06-22

Osele, Mark A (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

C156S583200, C029S239000, C438S458000

Reexamination Certificate

active

07740735

ABSTRACT:
A tool and method for disuniting two wafers, wherein at least one of the wafers is used in fabricating substrates for microelectronics, optoelectronics, or optics. The method includes the steps of temporarily affixing two gripper members to respective opposite faces of the wafers; and sufficiently displacing one of the gripper members relative to the other for inducing controlled flexing in at least one of the members and for exerting a force close to one edge of the wafers to assist in disuniting the wafers. If desired, the bonding energy between two wafers can be determined by measuring the force exerted during the displacement step or measuring the separation of the wafers while performing the disuniting operation.

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