4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Yuanlin Xie

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Consolidated flip chip BGA assembly process and apparatus

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Method of optimizing interconnect distribution to improve...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
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On-package edge-mount power decoupling and implementation...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
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Profile ID: LFUS-PAI-P-3111990

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