Consolidated flip chip BGA assembly process and apparatus

Details Consolidated flip chip BGA assembly process and apparatus Consolidated flip chip BGA assembly process and apparatus

2007-08-28

2007-08-28

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S106000, C438S126000, C438S125000, C257SE21001

Reexamination Certificate

active

11056821

ABSTRACT:
A flip chip packaging technique and associated apparatus that consolidates many or all of the steps in a conventional flip chip packaging process results in substantially decreased packaging time, e.g., only one to two hours, complexity, e.g., requiring fewer pieces and much simpler equipment, and cost, arising from reduced equipment operation and maintenance time and decreased labor. An assembly fixture useful for implementing the consolidated assembly technique engages and holds in place a semiconductor flip chip die with a plurality semiconductor package components in a desired package configuration so that they can be assembled into a semiconductor package with a single application of heat and pressure.

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patent: 6219911 (2001-04-01), Estes et al.
patent: 6701614 (2004-03-01), Ding et al.
patent: 2005/0026326 (2005-02-01), Kiritani et al.
patent: 410022342 (1998-01-01), None

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