On-package edge-mount power decoupling and implementation...

Details On-package edge-mount power decoupling and implementation... On-package edge-mount power decoupling and implementation...

2007-12-18

2007-12-18

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S723000

Reexamination Certificate

active

11478017

ABSTRACT:
A package substrate is provided with a side/edge-mounted decoupling capacitor that can provide substantially instant power or control simultaneous switching noise (SSN) associated with a semiconductor device package. A fabrication method for such a package substrate is also provided. Further, a semiconductor device package that includes such a package substrate is provided. According to various embodiments, the decoupling capacitor is connected to edges or sides of a power plane and a ground plane in the package substrate for connection via the semiconductor device package's power delivery system to a power source or component.

REFERENCES:
patent: 7081661 (2006-07-01), Takehara et al.
patent: 7230317 (2007-06-01), Pearson et al.

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