4. Semiconductor device manufacturing: process
  5. With measuring or testing

Yu-Lung Yu

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active

Integrated circuit chip and manufacturing process thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular signal path connections
Reexamination Certificate

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Wafer level testing and bumping process

Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate

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Wafer level testing and bumping process

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2859966

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