Wafer level testing and bumping process

Details Wafer level testing and bumping process Wafer level testing and bumping process

2005-03-22

2005-03-22

Smith, Matthew (Department: 2825)

Semiconductor device manufacturing: process

With measuring or testing

C438S131000, C438S612000

Reexamination Certificate

active

06869809

ABSTRACT:
A wafer level testing and bumping process is provided. A plurality of test pads serving as testing point for testing and analyzing the circuits within the wafer is formed on the active surface of the wafer. The test pads are electrically connected to the flip-chip bonding pads respectively. The test pads are positioned on the peripheral section of the active surface. The tip of probe pins hanging from a cantilever probe card touches the test pads so that the wafer can be tested through the probe pins to obtain some test results. Whether to cut a particular fuse line underneath a fuse window by aiming a laser beam at the fuse window can be determined according to the test results. Finally, a passivation layer and bumps are formed on the active surface of the wafer and then the wafer is cut to form a plurality of single chips ready for performing subsequent packing processes.

REFERENCES:
patent: 5346861 (1994-09-01), Khandros et al.
patent: 5682061 (1997-10-01), Khandros et al.
patent: 6361959 (2002-03-01), Beroz et al.
patent: 6372627 (2002-04-01), Ring et al.
patent: 6437591 (2002-08-01), Farnworth et al.
patent: 6600171 (2003-07-01), Farnworth et al.
patent: 6670634 (2003-12-01), Akram et al.
patent: 6680213 (2004-01-01), Farnworth et al.
patent: 6687989 (2004-02-01), Farnworth et al.
patent: 6708399 (2004-03-01), Farnworth et al.
patent: 20020135055 (2002-09-01), Cho et al.
patent: 20030116835 (2003-06-01), Miyamoto et al.

Affiliated with

Also associated with

Rating

Wafer level testing and bumping process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wafer level testing and bumping process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wafer level testing and bumping process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3456301