Integrated circuit chip and manufacturing process thereof

Details Integrated circuit chip and manufacturing process thereof Integrated circuit chip and manufacturing process thereof

2006-03-23

2008-08-12

Menz, Douglas M (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Gate arrays

With particular signal path connections

C257S700000, C438S106000, C438S128000

Reexamination Certificate

active

07411228

ABSTRACT:
An integrated circuit chip includes a substrate, a device layer, an interconnection layer, a sealing base layer and a sealing ring stack layer. The substrate has a sealing region and a chip region. The sealing region is disposed around the chip region. The device layer is disposed within the chip region. The interconnection layer is disposed over and connected with the device layer. The sealing base layer is disposed within the sealing region. The sealing ring stack layer is disposed over and connected with the sealing base layer. A manufacturing process of the integrated circuit chip is also disclosed.

REFERENCES:
patent: 2002/0125577 (2002-09-01), Komada
patent: 2005/0098893 (2005-05-01), Tsutsue et al.
patent: 2005/0151239 (2005-07-01), Lee
patent: 2005/0179213 (2005-08-01), Huang et al.

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