4. Stock material or miscellaneous articles
  5. All metal or with adjacent metals
  6. Foil or filament smaller than 6 mils

Yoshinori Tanii

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Method of making thin copper foil for printed wiring board

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly single metal or alloy substrate of...
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Method of treating the surface of the copper foil used in printe

Chemistry: electrical and wave energy – Processes and products
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Thin copper foil for printed wiring board

Stock material or miscellaneous articles – All metal or with adjacent metals – Foil or filament smaller than 6 mils
Patent

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Profile ID: LFUS-PAI-P-55815

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