Method of making thin copper foil for printed wiring board

Details Method of making thin copper foil for printed wiring board Method of making thin copper foil for printed wiring board

1991-03-18

1992-05-19

Tufariello, T. M.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating predominantly single metal or alloy substrate of...

205187, C25D 358, C25D 706

Patent

active

051145430

ABSTRACT:
A thin copper foil for a printed wiring board comprising a copper foil supporter having a rough surface on at least a side thereof, a parting layer laid on the side of the rough surface, a thin copper foil layer laid on the parting layer, and a copper-nickel compound metal layer interposed between the parting layer and the thin copper foil layer, and a method of manufacturing thereof.

REFERENCES:
patent: 4131517 (1978-12-01), Mitsuo
patent: 5019222 (1991-05-01), Hino

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