Thin copper foil for printed wiring board

Details Thin copper foil for printed wiring board Thin copper foil for printed wiring board

1992-11-30

1993-11-16

Lewis, Michael

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

428612, 428632, 428687, 428675, B32B 1520

Patent

active

052622479

ABSTRACT:
A thin copper foil for a printed wiring board comprising a copper foil supporter having a surface with a roughness; a parting payer consisting of chrome compound; a thin copper foil layer formed on the parting layer which will be attached to a board as printed wiring. A copper-nickel compound metal layer is interposed between the parting layer and the thin copper foil layer, wherein said copper-nickel compound metal layer is formed to be integral with the thin copper foil layer with a peel strength therebetween such that said copper-nickel compound metal layer will be left on the thin copper layer when the parting layer with the copper foil supporter is peeled off.

REFERENCES:
patent: 4394419 (1983-07-01), Konicek
patent: 4661417 (1987-04-01), Suzuki et al.

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