4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Configuration or pattern of bonds

Yoshihide Nishiyama

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Apparatus for manufacturing semiconductor devices, method of...

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Apparatus used for manufacturing semiconductor device,...

Metal working – Means to assemble or disassemble – Means to assemble electrical device
Reexamination Certificate

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Device for evaluating internal quality of vegetable or...

Data processing: measuring – calibrating – or testing – Measurement system in a specific environment – Quality evaluation
Reexamination Certificate

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Device package structure, device packaging method, droplet...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate

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Method for manufacturing semiconductor device and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Profile ID: LFUS-PAI-P-2190876

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