Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2011-05-17
2011-05-17
Roman, Angel (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S701000, C257S734000, C257SE23141, C347S050000, C347S058000, C347S059000, C347S068000
Reexamination Certificate
active
07944060
ABSTRACT:
A device package structure includes: a base body having a conductive connection portion and a level difference portion; a device arranged on the base body, having a connection terminal electrically connected to the conductive connection portion via the level difference portion on the base body; and a connector electrically connecting the connection terminal and the conductive connection portion, having substantially the same height as a height of the level difference portion.
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Mizuno Shinji
Nishiyama Yoshihide
Sato Eiichi
Harness & Dickey & Pierce P.L.C.
Roman Angel
Seiko Epson Corporation
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