Apparatus for manufacturing semiconductor devices, method of...

Details Apparatus for manufacturing semiconductor devices, method of... Apparatus for manufacturing semiconductor devices, method of...

2004-10-01

2008-11-25

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Plural joints

C228S223000

Reexamination Certificate

active

07455213

ABSTRACT:
An apparatus10A for manufacturing semiconductor devices includes a plurality of receiving portions12for receiving an upper semiconductor package30on a top surface of the receiving portion12. The receiving portion has a function of restricting the movement of the upper semiconductor package30in a direction parallel to a top surface of the upper semiconductor package30. The receiving portion12is a concave portion in which the upper semiconductor package30is adapted to be received. An adhesive material having a function of immovably holding the upper semiconductor package30to the receiving portion12may be provided within the receiving portion12, for example.

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Communication from Japanese Patent Office regarding related application.

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