Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-07-26
2009-02-17
Doan, Theresa T (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257S777000, C257S621000
Reexamination Certificate
active
07491582
ABSTRACT:
A semiconductor device includes: a connecting body including a connecting electrode; and at least one semiconductor chip stacked on the connecting body, the semiconductor chip including: a substrate; and a trans-substrate conductive plug that penetrates the substrate, the trans-substrate conductive plug having a first terminal that is provided on an active surface side of the substrate; and a second terminal that is provided on a back surface side that is opposite the active surface side, an outer shape of the first terminal being formed larger than an outer shape of the second terminal, wherein the second terminal of the semiconductor chip is electrically connected to a connecting electrode of the connecting body via a brazing material.
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Communication from Japanese Patent Office regarding corresponding application.
Nishiyama Yoshihide
Yokoyama Yoshihiko
Doan Theresa T
Harness & Dickey & Pierce P.L.C.
Seiko Epson Corporation
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