4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package

Yoshihide Iwazaki

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Heat-resistant adhesive sheet

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer
Reexamination Certificate

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Manufacturing method of semiconductor device

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of forming resin film of desired pattern on semiconductor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Patent

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Method of forming resin film of desired pattern on semiconductor

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent

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Process for fabricating a crack resistant resin encapsulated sem

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

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Profile ID: LFUS-PAI-P-182264

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