Process for fabricating a crack resistant resin encapsulated sem

Details Process for fabricating a crack resistant resin encapsulated sem Process for fabricating a crack resistant resin encapsulated sem

1998-03-19

2000-04-04

Bowers, Charles

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438106, H01L 2160

Patent

active

060460725

ABSTRACT:
A heat-resistant adhesive is provided for use in an adhesive member for the fabrication of a semiconductor package by bonding a semiconductor chip to a lead frame with the adhesive member and sealing at least the semiconductor chip and a bonded part between the semiconductor chip and the lead frame with a sealant. The adhesive has a coming-out length of not more than 2 mm and a water absorption rate of not more than 3 wt. %. Preferably, the adhesive has a glass transition point of at least 200.degree. C.

REFERENCES:
patent: 4545840 (1985-10-01), Newman et al.
patent: 4862245 (1989-08-01), Pashley et al.
patent: 5068712 (1991-11-01), Murakami et al.
patent: 5140404 (1992-08-01), Fogal et al.
patent: 5254412 (1993-10-01), Fujimoto
patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5434106 (1995-07-01), Lim et al.
patent: 5441918 (1995-08-01), Morisaki et al.
patent: 5714405 (1998-02-01), Tsubosaki et al.
Charles A. Harper and Ronald N. Sampson, Electronic Materials and Processes Handbook, p. 1.37, 1.64, 2.19, 2.89, 1994.
Matsuura et al., "Polimides & resins" (Nov. 13, 1991) EP-466515, Chem. Abs. (116:256718).

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