4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Multiple housings

Yonggill Lee

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Packaging method for segregating die paddles of a leadframe

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Semiconductor package and stack arrangement thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Stacked package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3035695

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