4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Yong-Jin Jung

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Semiconductor chip package manufacturing method including...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Semiconductor package which includes an insulating layer...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stack package using anisotropic conductive film (ACF) and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Stack package using anisotropic conductive film (ACF) and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Stack package using anisotropic conductive film (ACF) and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2385228

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