Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2011-08-02
2011-08-02
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE23141, C257SE23024, C257S784000, C257S680000, C257S773000, C257S774000, C257S775000, C257S776000, C257S786000
Reexamination Certificate
active
07989939
ABSTRACT:
Provided is a semiconductor package. The semiconductor package includes a bonding wire electrically connecting a first package substrate and a second package substrate to each other and an insulating layer adhering the first package substrate and the second package substrate to each other and covering a portion of the bonding wire.
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Hwang Hyun-Ik
Jung Yong-Jin
Song Kunho
F. Chau & Associates LLC
Samsung Electronics Co,. Ltd.
Williams Alexander O
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