Semiconductor package which includes an insulating layer...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

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Details

C257SE23141, C257SE23024, C257S784000, C257S680000, C257S773000, C257S774000, C257S775000, C257S776000, C257S786000

Reexamination Certificate

active

07989939

ABSTRACT:
Provided is a semiconductor package. The semiconductor package includes a bonding wire electrically connecting a first package substrate and a second package substrate to each other and an insulating layer adhering the first package substrate and the second package substrate to each other and covering a portion of the bonding wire.

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