Semiconductor chip package manufacturing method including...

Details Semiconductor chip package manufacturing method including... Semiconductor chip package manufacturing method including...

2007-10-30

2007-10-30

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C257S782000, C257S783000, C257SE21122

Reexamination Certificate

active

11003378

ABSTRACT:
A method for manufacturing a semiconductor chip package may include screen printing an adhesive on a substrate using a screen printing mask. The adhesive may be heated during a first curing process. A semiconductor chip may be attached to the adhesive on the substrate. The adhesive may be heated during a second curing process. The physical property of the adhesive may be transformed before and after a screen printing process to improve the operational performance and/or quality of the adhesive.

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Korean Office Action dated Mar. 27, 2006.

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