4. Television
  5. Camera, system and detail
  6. Solid-state image sensor

Ying-Cheng Wu

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Chip package, method of making same and digital camera...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Digital camera module

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate

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Digital camera module package fabrication method

Radiant energy – Photocells; circuits and apparatus – Photocell controlled circuit
Reexamination Certificate

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Digital camera module package fabrication method

Radiant energy – Photocells; circuits and apparatus – Photocell controlled circuit
Reexamination Certificate

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Digital camera module using stacked chip package

Television – Special applications – With endoscope
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2255616

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