Digital camera module using stacked chip package

Details Digital camera module using stacked chip package Digital camera module using stacked chip package

2006-11-03

2011-12-06

Neurauter, George (Department: 2447)

Television

Special applications

With endoscope

C348S373000

Reexamination Certificate

active

08072489

ABSTRACT:
A chip package (101) and a lens module (103) mounted on the chip package are provided. The chip package includes a substrate (20), a first chip (40), a second chip (70), and a cover (80). The first chip is mounted on the substrate and is electrically connected with the substrate via a first plurality of wires (50a). The second chip is mounted above the first chip and above the wires connected with the first chip and is electrically connected with the substrate via a second plurality of wires (50b). The cover is mounted above the second chip and the wires connected with the second chip.

REFERENCES:
patent: 2001/0033338 (2001-10-01), Hunter
patent: 2003/0001960 (2003-01-01), Kato et al.
patent: 2003/0234886 (2003-12-01), Cho et al.
patent: 2005/0285239 (2005-12-01), Tsai et al.
patent: 2459631 (2001-11-01), None
patent: 1372322 (2002-10-01), None
patent: 2599758 (2004-01-01), None

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