Digital camera module package fabrication method

Details Digital camera module package fabrication method Digital camera module package fabrication method

2008-03-11

2008-03-11

Lee, John R. (Department: 2878)

Radiant energy

Photocells; circuits and apparatus

Photocell controlled circuit

C250S239000

Reexamination Certificate

active

11453454

ABSTRACT:
A digital camera module package method includes the steps of: firstly, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces (322); Secondly, mounting an image sensor chip (34) on the base and received in the cavity, the image sensor having a photosensitive area. Thirdly, providing a plurality of wires (36), each electrically connecting the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourthly, applying an adhesive means (3262) around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover (38) on the carrier, where an adhesive means fixes the cover in place.

REFERENCES:
patent: 5159432 (1992-10-01), Ohkubo et al.
patent: 5877546 (1999-03-01), You
patent: 5950074 (1999-09-01), Glenn et al.
patent: 6034429 (2000-03-01), Glenn et al.
patent: 6384472 (2002-05-01), Huang
patent: 6420204 (2002-07-01), Glenn
patent: 6630727 (2003-10-01), Tutsch et al.
patent: 6686588 (2004-02-01), Webster et al.
patent: 6759266 (2004-07-01), Hoffman
patent: 7095621 (2006-08-01), Saimun et al.
patent: 2004/0041088 (2004-03-01), Chen
patent: 2004/0165356 (2004-08-01), Mun et al.
patent: 2005/0258518 (2005-11-01), Yang et al.
patent: 03100661.2 (2004-08-01), None

Affiliated with

Also associated with

Rating

Digital camera module package fabrication method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Digital camera module package fabrication method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Digital camera module package fabrication method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3924476