Yih-Shung Lin

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Aluminum contact structure for integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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CMP apparatus and process sequence method

Abrading – Precision device or process - or with condition responsive... – With indicating
Reexamination Certificate

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CMP apparatus and process sequence method

Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate

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CMP process control method

Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate

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Enhanced planarization technique for an integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Reissue Patent

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Profile ID: LFUS-PAI-P-112843

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