Enhanced planarization technique for an integrated circuit

Details Enhanced planarization technique for an integrated circuit Enhanced planarization technique for an integrated circuit

1998-01-15

1999-11-16

Meier, Stephen D.

Active solid-state devices (e.g., transistors, solid-state diode

With means to control surface effects

Insulating coating

257647, 257634, H01L 2358

Patent

active

059863307

ABSTRACT:
A method for planarizing integrated circuit topographies, wherein, after a first layer of spin-on glass is deposited, a layer of low-temperature oxide is deposited before a second layer of spin-on glass.

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