Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
Inventor
active
Dual-sided heat dissipating structure for integrated circuit...
Enhanced heat dissipating chip scale package method and devices
Stacked chip scale package structure
Structure of plated wire of fiducial marks for die-dicing...
Thin enhanced TAB BGA package having improved heat dissipation
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Profile ID: LFUS-PAI-P-398615