4. Electric heating
  5. Metal heating
  6. For bonding with pressure

Yaw-Hwang Chen

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Ancillary pads for on-circuit array probing composed of I/O and

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Patent

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Bipolar stripe transistor structure

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Lateral bipolar transistor structure
Patent

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Method of making a bipolar stripe transistor structure

Fishing – trapping – and vermin destroying
Patent

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Wafer scale multi-chip module

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Wafer scale multi-chip module

Electric heating – Metal heating – For bonding with pressure
Patent

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Profile ID: LFUS-PAI-P-278537

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