Ancillary pads for on-circuit array probing composed of I/O and

Details Ancillary pads for on-circuit array probing composed of I/O and Ancillary pads for on-circuit array probing composed of I/O and

1997-08-27

1998-11-17

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

257503, 257673, 257700, 257758, 257778, 257781, 438406, 438453, 438593, 438622, H01L 2940

Patent

active

058380230

ABSTRACT:
An integrated circuit device is provided that has I/O bonding pads across the surface of the chip, where the I/O bonding pads can be electrically accessed via ancillary testing pads in order to perform functionality or other necessary tests prior to bump bonding formation without damaging the bonding pads or the underlying circuitry.

REFERENCES:
patent: 4249193 (1981-02-01), Balyoz et al.
patent: 5239191 (1993-08-01), Sakumoto et al.
patent: 5250841 (1993-10-01), Sloan et al.
patent: 5394013 (1995-02-01), Oku et al.
patent: 5536584 (1996-07-01), Sotokawa et al.
IBM Tech. Disclosure Bulletin, vol. 13 No. 7 Dec. 1970 D.E. Shults.

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