Wafer scale multi-chip module

Details Wafer scale multi-chip module Wafer scale multi-chip module

1995-02-10

1996-04-09

Ledynh, Bot L.

Electric heating

Metal heating

For bonding with pressure

427 96, 29831, 29832, 437209, 437902, B23K 1002, H01L 2160, H05K 320

Patent

active

055063837

ABSTRACT:
A wafer scale multi-chip semiconductor module used to interconnect and house a plurality of integrated circuit chips. The wafer scale multi-chip semiconductor module has an interconnect network extending between the integrated circuit chips along the substrate of the semiconductor wafer module, which allows electrical access to the integrated circuit chips by means of electrically conductive bridge connections. The integrated circuit chips are placed in openings in the semiconductor wafer module, allowing for excellent planarity.

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