Metal fusion bonding
Process
With protecting of work or filler or applying flux
Inventor
active
Automatic reflow soldering apparatus
Device for heating printed-circuit board
Reflow soldering apparatus
Reflow soldering method and the apparatus thereof
Reflow soldering method and the apparatus thereof
No associations
LandOfFree
Yatsuharu Yokota does not yet have a rating. At this time, there are no reviews or comments for this inventor.
If you have personal experience with Yatsuharu Yokota, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Yatsuharu Yokota will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-P-600957