Reflow soldering method and the apparatus thereof

Details Reflow soldering method and the apparatus thereof Reflow soldering method and the apparatus thereof

1991-05-30

1992-08-25

Heinrich, Samuel M.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228222, 228 42, 219399, 219539, 432233, B23K 1012

Patent

active

051411474

ABSTRACT:
A reflow soldering method and the apparatus thereof is described for soldering a base board having electronic elements located thereon by an inert gas circulated through heater means in a plurality of chambers while the base board is transported through all the chambers, the inert gas being circulated by ventilating means driven by drive means, the method and the apparatus thereof comprising a shield case for enclosing at least the chambers, the ventilating means and the drive means to shut off the same from an outer air and refrigerating means for cooling down the inert gas in the shield case.

REFERENCES:
patent: 3261596 (1966-07-01), Bowman
patent: 4140266 (1979-02-01), Wagner
patent: 4832249 (1989-05-01), Ehler
patent: 4909430 (1990-03-01), Yokota

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