Automatic reflow soldering apparatus

Details Automatic reflow soldering apparatus Automatic reflow soldering apparatus

1997-02-26

1999-07-13

Pelham, Joseph

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

2281801, 1984653, F27B 924, B23K 1008, B23K 3202, B65G 3700

Patent

active

059222301

ABSTRACT:
A transport mechanism for printed circuit boards is comprised of two endless drive members, movable carriers installed between these two drive members and one pair of parallel guide rails to support the carriers while moving in a horizontal state. The drive members extend diagonally between horizontal upper and lower runs on both ends of the mechanism. The carriers are installed at fixed intervals along the length of the drive members. The carriers are also provided with a roller member on both sides of the carrier to run on the upper part of the guide rail. The guide rail is further installed diagonally along the diagonal portion of the drive members at fixed intervals in order to support the carrier horizontally while in a diagonal state of movement.

REFERENCES:
patent: 4512510 (1985-04-01), Kondo
patent: 4909430 (1990-03-01), Yokota
patent: 4962695 (1990-10-01), Northrup
patent: 5024370 (1991-06-01), Yokota
patent: 5242096 (1993-09-01), Tsunabuchi et al.
patent: 5465827 (1995-11-01), Nakagawa et al.
patent: 5495933 (1996-03-01), Gyger

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