Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1989-02-21
1990-03-20
Seidel, Richard K.
Metal fusion bonding
Process
With condition responsive, program, or timing control
2281802, 228232, 228240, 228 20, 228 21, 219388, 219396, 219400, 219 8517, B23K 300, B23K 3102
Patent
active
049094300
ABSTRACT:
A reflow soldering method and the apparatus thereof is disclosed, wherein an air flowing fan is provided at the bottom of the apparatus, that is, below a work transporting conveyor so as to produce a minus pressure to draw or pull air into the apparatus in a manner that the drawn air may flow in a constant volume and at a constant speed from up to down through a predetermined path and flow down through a heater provided in the path to be heated up substantially to a set temperature of the heater. The heated air further flows down to contact a work such as a base board having electronic parts mounted thereon and transported by the conveyor and heat up the work. The air is then sent out of the above mentioned air circulating path by the fan into a another path which allows the air to flow from down to up into an air chamber located above the heater, the air chamber is of a sufficient capacity to remarkably reduce the flowing speed of the air to stagnate the same therein for preparation of the next air circulation through the above mentioned air circulating paths to heat up the work as the latter is transported by the conveyor.
REFERENCES:
patent: 3515330 (1970-06-01), Bronson et al.
patent: 3769675 (1973-11-01), Chartet
patent: 3882596 (1975-05-01), Kendziora et al.
patent: 4648547 (1987-03-01), Mahler et al.
patent: 4771929 (1988-09-01), Bahr et al.
Eightic Tectron Co., Ltd.
Heinrich Samuel M.
Seidel Richard K.
Ziems Robert F.
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