4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Yasutake Yaguchi

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Lead frame, electronic component including the lead frame,...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Semiconductor device and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Semiconductor device and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Semiconductor device including a diffusion layer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Semiconductor device including a diffusion layer formed...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2340430

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