Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2005-10-11
2005-10-11
Huynh, Andy (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S673000, C257S693000, C257S737000, C257S738000, C257S773000, C257S775000, C257S780000
Reexamination Certificate
active
06954001
ABSTRACT:
The semiconductor device includes a semiconductor element having an electrode formed on a surface thereof, and a metal wiring formed on the surface of the semiconductor element and electrically connected to the electrode. The metal wiring has an external electrode portion functioning as an external electrode. A thickness of the external electrode portion is greater than that of a non-electrode portion of the metal wiring, i.e., a portion of the metal wiring other than the external electrode portion.
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Kainou Kazuyuki
Miki Keiji
Nakamura Yoshifumi
Sahara Ryuichi
Shimoishizaka Nozomi
Huynh Andy
Matsushita Electric - Industrial Co., Ltd.
McDermott Will & Emery LLP
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