4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Yasuhiro Yamaji

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Electronic device having a chip with an external bump terminal e

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Manufacturing method of semiconductor device

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Semiconductor apparatus capable of cooling a semiconductor eleme

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Semiconductor apparatus capable of cooling a semiconductor eleme

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Semiconductor device

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Profile ID: LFUS-PAI-P-392158

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