Semiconductor apparatus capable of cooling a semiconductor eleme

Details Semiconductor apparatus capable of cooling a semiconductor eleme Semiconductor apparatus capable of cooling a semiconductor eleme

1995-06-06

1996-10-22

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257686, 257723, H01L 2334, H01L 2302

Patent

active

055679838

ABSTRACT:
A heat sink is attached to a semiconductor element functioning as an exothermic element, which is mounted on a circuit board and has a predetermined allowable power consumption, thereby cooling the semiconductor element. A semiconductor element having a lower allowable power consumption than the semiconductor element having the predetermined power consumption, which is hardly exposed to a cooling air flow cooled via the heat sink, is connected to a heat conductive auxiliary member connected at one end to the heat sink. Thus, the heat radiation efficiency of the semiconductor element having the lower allowable power consumption is enhanced.

REFERENCES:
patent: 5361188 (1994-11-01), Kondou et al.
patent: 5444296 (1995-08-01), Kaul et al.

Affiliated with

Also associated with

Rating

Semiconductor apparatus capable of cooling a semiconductor eleme does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor apparatus capable of cooling a semiconductor eleme, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor apparatus capable of cooling a semiconductor eleme will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2360770