Semiconductor device

Details Semiconductor device Semiconductor device

1987-12-18

1989-08-08

Hille, Rolf

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 70, 174 524, H01L 2348, H01L 2328

Patent

active

048558079

ABSTRACT:
This invention provides a semiconductor device comprising a die-pad supported by tie-bars, a semiconductor element mounted on the die-pad with the die-pad, tie-bars and semiconductor element being encapsulated in a moulding compound, means for defining an aperture which extends in to the moulding compound so as to expose a portion of a tie-bar.

REFERENCES:
patent: 4250347 (1981-02-01), Fierkens
IEEE (1985), p. 192, Moisture Resistance Degradation of Plastic LSI's, by Reflow Soldering, Nanbu et al. (FIG. 9 and p. 193).
23rd Annual Proceedings of Reliability Physics 1985, Orlando, Fla., Mar. 26th-28th, 1985, pp. 192-197, IEEE, N.Y., US, I. Fukuzawa et al.: "Moisture Resistance Degradation of Plastic LSIs, by Reflow Soldering", *p. 192*.
Patent Abstracts of Japan, vol. 11, No. 7 (E-469) [2454], Jan. 9th, 1987; & JP-A-61 184 855 (OKI Electric Co. Ltd.), 08-18-1986 *Abstract*.
Patent Abstracts of Japan, vol. 10, No. 370 (E-463) [2427], Dec. 10th, 1986; & JP-A-61 166 052 (Hitachi Ltd.), 07-26-1986 *Abstract*.
Patent Abstracts of Japan, vol. 11, No. 20 (E-472) [2467], Jan. 20th, 1987; & JP-A-61 191 055 (Toshiba Corp.), 08-25-1986.

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