Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1995-06-16
1996-08-20
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257706, 257707, 257686, 257771, 257796, H01L 2324, H01L 2310, H01L 2334, H01L 2302
Patent
active
055481612
ABSTRACT:
A heat sink is attached to a semiconductor element functioning as an exothermic element, which is mounted on a circuit board and has a predetermined allowable power consumption, thereby cooling the semiconductor element. A semiconductor element having a lower allowable power consumption than the semiconductor element having the predetermined power consumption, which is hardly exposed to a cooling air flow cooled via the heat sink, is connected to a heat conductive auxiliary member connected at one end to the heat sink. Thus, the heat radiation efficiency of the semiconductor element having the lower allowable power consumption is enhanced.
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patent: 4811166 (1989-03-01), Alvarez et al.
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patent: 5003429 (1991-03-01), Baker et al.
patent: 5168348 (1992-12-01), Chu et al.
patent: 5272599 (1993-12-01), Koenen
patent: 5444296 (1995-08-01), Kaul et al.
Hirano Naohiko
Yamaji Yasuhiro
Arroyo T. M.
Crane Sara W.
Kabushiki Kaisha Toshiba
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