4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Yasuhiro Oura

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Method and apparatus for applying a protective tape on a wafer a

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Method for manufacturing SOI wafer

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Reexamination Certificate

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Silicon wafer for IGBT and method for producing same

Chemistry of inorganic compounds – Silicon or compound thereof – Oxygen containing
Reexamination Certificate

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Silicon wafer for IGBT and method for producing same

Chemistry of inorganic compounds – Silicon or compound thereof – Oxygen containing
Reexamination Certificate

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Silicon wafer for IGBT and method for producing same

Single-crystal – oriented-crystal – and epitaxy growth processes; – Processes of growth from liquid or supercritical state – Having pulling during growth
Reexamination Certificate

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Profile ID: LFUS-PAI-P-844354

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