Method and apparatus for applying a protective tape on a wafer a

Details Method and apparatus for applying a protective tape on a wafer a Method and apparatus for applying a protective tape on a wafer a

1988-11-09

1990-05-15

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156267, 156510, 156522, 156523, 156530, 156552, 83483, 83490, B32B 3118

Patent

active

049255150

ABSTRACT:
A method for applying a protective tape on a wafer and cutting it out to the shape of the wafer in the process of manufacture of integrated circuits and the like, and an apparatus for use in carrying out the method. The method enables the protective tape to be applied on the wafer without allowing intersurface inclusion of air bubbles and to be accurately cut along the perimeter of the wafer. Any dimensional change with respect to the wafer can be properly coped with.
The protective tape, as drawn out from a winder shaft, is applied by means of an application roller on the wafer which is supported and fixed in position on a transfer table.
The tape is cut along an orientation flat of the wafer by a subcutter which is in movement integrally with the application roller. A main cutter positioned above the wafer is then lowered and caused to swivel, whereby the protective tape is cut along a circumferential edge of the wafer so that the tape on the wafer is cut out to the contour of the wafer. Any remaining portion of the tape after the cut-out is made is wound onto a take-up shaft.

REFERENCES:
patent: 4522679 (1985-06-01), Funakoshi et al.
patent: 4568407 (1986-02-01), Barbieri et al.
patent: 4683023 (1987-07-01), Sokolovsky

Affiliated with

Also associated with

Rating

Method and apparatus for applying a protective tape on a wafer a does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for applying a protective tape on a wafer a, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for applying a protective tape on a wafer a will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-619634