Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2011-07-19
2011-07-19
Landau, Matthew C (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S074000, C438S107000, C438S618000, C257S685000, C257S686000, C257S774000, C257SE23141, C257SE23145, C257SE25013
Reexamination Certificate
active
07981726
ABSTRACT:
An embodiment of the present invention is a technique to construct a multi-die package. A stack of dice is formed from a base substrate in a package. The dice are positioned one on top of another and have copper plated segments for die interconnection. The dice are interconnected using copper plating to connect the copper plated segments.
REFERENCES:
patent: 6235554 (2001-05-01), Akram et al.
patent: 6750547 (2004-06-01), Jeung et al.
patent: 7112815 (2006-09-01), Prall
patent: 2009/0217518 (2009-09-01), Hiroshi et al.
Li Jianmin
Tang John J.
Xu Henry
Zeng Xiang Yin
Intel Corporation
Landau Matthew C
Ortiz Kathy J.
Snow Colleen E
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