Copper plating connection for multi-die stack in substrate...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S074000, C438S107000, C438S618000, C257S685000, C257S686000, C257S774000, C257SE23141, C257SE23145, C257SE25013

Reexamination Certificate

active

07981726

ABSTRACT:
An embodiment of the present invention is a technique to construct a multi-die package. A stack of dice is formed from a base substrate in a package. The dice are positioned one on top of another and have copper plated segments for die interconnection. The dice are interconnected using copper plating to connect the copper plated segments.

REFERENCES:
patent: 6235554 (2001-05-01), Akram et al.
patent: 6750547 (2004-06-01), Jeung et al.
patent: 7112815 (2006-09-01), Prall
patent: 2009/0217518 (2009-09-01), Hiroshi et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Copper plating connection for multi-die stack in substrate... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper plating connection for multi-die stack in substrate..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper plating connection for multi-die stack in substrate... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2626770

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.