Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-08-14
2007-08-14
Vu, Hien (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C439S941000
Reexamination Certificate
active
11324040
ABSTRACT:
Data signal interconnections are described that offer reduced cross talk particularly with high speed differential signaling. In one example, the invention includes a plurality of interconnects to carry data signals between a first component and a second component, the plurality of interconnects including a first set of interconnects oriented in a first direction and a second set of interconnects oriented in a second direction, different from the first direction.
REFERENCES:
patent: 4427247 (1984-01-01), Petersen
patent: 4652973 (1987-03-01), Baker et al.
patent: 4855719 (1989-08-01), Posey
patent: 6017247 (2000-01-01), Gwiazdowski
patent: 6449165 (2002-09-01), Lee et al.
He Jiangqi
Xu BaoShu
Zeng Xiang Yin
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