4. Optics: measuring and testing
  5. Inspection of flaws or impurities
  6. Bore inspection

Xian J. Ning

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Bond pad for low K dielectric materials and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With thin active central semiconductor portion surrounded by...
Reexamination Certificate

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Design of lithography alignment and overlay measurement...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate

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Dry process for cleaning residues/polymers after metal etch

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Dual damascene with bond pads

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Dummy patterns and method of manufacture for mechanical...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-437826

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