4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Wing Him Lau

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Chip scale integrated circuit package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Leadless plastic chip carrier

Stock material or miscellaneous articles – Structurally defined web or sheet – Including grain – strips – or filamentary elements in...
Reexamination Certificate

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Leadless plastic chip carrier with etch back pad singulation

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Leadless plastic chip carrier with etch back pad singulation

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Leadless plastic chip carrier with etch back pad singulation

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2634386

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